(3 in 1 Die Sorter)
u(3 in 1 Die Sorter)
- 將Wafer Tap 或是4”Tray上Die取起，轉移至放置於4”Tray或是貼附於另一片Wafer Tap
- l作業模式: Wafer to Wafer 、 Wafer to Tray 、 Tray To Wafer 等三種.
- lDie Size : 5mm x 5mm ~ 20mm x 20mm
- lDie Thickness : 40um
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